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Laser Exposure Equipment - List of Manufacturers, Suppliers, Companies and Products

Laser Exposure Equipment Product List

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3D shape laser exposure device *under development*

3D shape laser exposure device *under development*

Achieving maskless photolithography for three-dimensional shapes through 5-axis stage control!

The "3D Shape Laser Exposure Device" enables fine patterning on various shapes through a 5-axis stage configuration (3 linear axes and 2 rotational axes). Since it performs direct exposure using a semiconductor laser, there is no need for a metal mask, contributing to reduced research and development time and budget. Additionally, it can read data created in 2D and 3D CAD using dedicated conversion software. 【Features】 ■ 5-axis stage configuration (3 linear axes and 2 rotational axes) ■ Capable of fine patterning on various shapes ■ No need for a metal mask, contributing to reduced research and development time and budget ■ Can read data created in 2D and 3D CAD using dedicated conversion software ■ Easy alignment of three-dimensional structural samples with the alignment assistance mechanism *For more details, please refer to the PDF document or feel free to contact us.

  • Other optical parts

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Telecentric fθ lens specifications for laser exposure equipment

Telecentric fθ lens specifications for laser exposure equipment

High-precision beam shape rendering is possible across the entire scanning width with telecentric fθ lenses and polygon mirrors using "raster scan type laser exposure."

This is a "laser exposure machine" that directly exposes positive and negative resists without a mask for pattern formation of insulating films, metal patterns, and the formation of banks and partitions in MEMS shapes related to printed electronics. It enables high-precision beam shape drawing across the entire scanning width through "raster scan type laser exposure" using a telecentric fθ lens and a polygon mirror. Laser wavelengths such as 375, 405, 650, 780, and 830 nm, including h-line and i-line, are selectable. Laser spot diameters of 2 μm (@405 nm), 10 μm, 22 μm, 30 μm, etc. Resolution options include up to 25,400 dpi, 5,080 dpi, and 3,000 dpi, among others. It can accommodate a wide range of photosensitive resists, including various semiconductor exposure resists, polyimide resists, and photosensitive Ag. Electrode formation can be achieved using organic TFT gate insulating films, photosensitive Ag inks, etc. Creating complex pattern shapes that are difficult with inkjet, flexo, or screen methods is made easy.

  • Printing Machinery

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